Group Leader – Die Prep & Dicing

Job/Position Summary The Group Leader – Die Prep & Dicing is responsible for leading development, optimization, qualification, and manufacturing support activities for wafer backgrinding, tape lamination, tape and DAF mounting, wafer sorting, laser grooving, wafer dicing, and post-dice die inspection processes used in advanced semiconductor assembly. The role focuses on achieving robust die preparation performance with emphasis on die thickness control, total thickness variation, die strength, …