Group Leader – Wire Bond & Mold

Job/Position Summary The Group Leader – Wire Bond & Mold is responsible for leading development, optimization, qualification, and manufacturing support activities for plasma treatment, wire bonding, compression and transfer molding, post-mold cure, deflash, and laser marking processes used in advanced semiconductor assembly. The role focuses on achieving robust interconnect and encapsulation performance with emphasis on bond strength and consistency, loop control, mold fill, package warpage, de…